IDT70P3599S166BCG8
vs
70V3599S166BC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
,
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
1
2
Pbfree Code
Rohs Code
Part Package Code
CABGA
Pin Count
256
Manufacturer Package Code
BC256
Access Time-Max
4 ns
Clock Frequency-Max (fCLK)
166 MHz
I/O Type
COMMON
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
Memory Density
4718592 bit
Memory IC Type
MULTI-PORT SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
2
Number of Terminals
256
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Standby Current-Max
0.03 A
Standby Voltage-Min
3.15 V
Supply Current-Max
0.5 mA
Supply Voltage-Max (Vsup)
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Compare IDT70P3599S166BCG8 with alternatives
Compare 70V3599S166BC with alternatives