IDT709269S12PF
vs
709269L12PFG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
RENESAS ELECTRONICS CORP
Part Package Code
QFP
Package Description
14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Pin Count
100
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
25 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
50 MHz
I/O Type
COMMON
JESD-30 Code
S-PQFP-G100
JESD-609 Code
e0
Length
14 mm
Memory Density
262144 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
2
Number of Terminals
100
Number of Words
16384 words
Number of Words Code
16000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
16KX16
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
Package Code
LFQFP
Package Equivalence Code
QFP100,.63SQ,20
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.345 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
Base Number Matches
1
2
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