IDT70825S35PFG
vs
70825S35PFI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
TQFP
Package Description
TQFP-80
QFP, QFP80,.64SQ
Pin Count
80
80
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
Additional Feature
AUTOMATIC POWER-DOWN
JESD-30 Code
S-PQFP-G80
S-PQFP-G80
JESD-609 Code
e3
e0
Length
14 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
STANDARD SRAM
APPLICATION SPECIFIC SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Terminals
80
80
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
8KX16
8KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
Base Number Matches
2
3
Manufacturer Package Code
PN80
Package Equivalence Code
QFP80,.64SQ
Standby Current-Max
0.015 A
Supply Current-Max
0.34 mA
Compare IDT70825S35PFG with alternatives
Compare 70825S35PFI with alternatives