IDT70825S20PFG vs 70825L20G feature comparison

IDT70825S20PFG Integrated Device Technology Inc

Buy Now Datasheet

70825L20G Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP PGA
Package Description TQFP-80 1.120 X 1.12 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-84
Pin Count 80 84
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
Additional Feature AUTOMATIC POWER-DOWN
JESD-30 Code S-PQFP-G80 S-CPGA-P84
JESD-609 Code e3 e0
Length 14 mm 27.94 mm
Memory Density 131072 bit 131072 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 80 84
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code LQFP PGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 5.207 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING PIN/PEG
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 27.94 mm
Base Number Matches 1 4
Manufacturer Package Code GU84
Package Equivalence Code PGA84M,11X11
Standby Current-Max 0.0015 A
Supply Current-Max 0.33 mA

Compare IDT70825S20PFG with alternatives

Compare 70825L20G with alternatives