IDT70825L20PF
vs
IDT70825S20G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
PGA
Package Description
TQFP-80
PGA-84
Pin Count
80
84
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
Additional Feature
AUTOMATIC POWER-DOWN
AUTOMATIC POWER-DOWN
JESD-30 Code
S-PQFP-G80
S-CPGA-P84
JESD-609 Code
e0
e0
Length
14 mm
27.94 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
80
84
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX16
8KX16
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
LQFP
PGA
Package Equivalence Code
QFP80,.64SQ
PGA84M,11X11
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
5.207 mm
Standby Current-Max
0.0015 A
0.015 A
Supply Current-Max
0.33 mA
0.38 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
TIN LEAD
Terminal Form
GULL WING
PIN/PEG
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
QUAD
PERPENDICULAR
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
27.94 mm
Base Number Matches
9
2
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