IDT70825L20G vs IDT70825S20PF9 feature comparison

IDT70825L20G Integrated Device Technology Inc

Buy Now Datasheet

IDT70825S20PF9 Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PGA QFP
Package Description PGA-84 TQFP-80
Pin Count 84 80
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
Additional Feature AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN
JESD-30 Code S-CPGA-P84 S-PQFP-G80
JESD-609 Code e0 e0
Length 27.94 mm 14 mm
Memory Density 131072 bit 131072 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 84 80
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX16 8KX16
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA LQFP
Package Equivalence Code PGA84M,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.207 mm 1.6 mm
Standby Current-Max 0.0015 A
Supply Current-Max 0.33 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position PERPENDICULAR QUAD
Width 27.94 mm 14 mm
Base Number Matches 2 1
Pbfree Code No
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare IDT70825L20G with alternatives

Compare IDT70825S20PF9 with alternatives