IDT70727L25PF vs M5M5V1132AFP-3T feature comparison

IDT70727L25PF Integrated Device Technology Inc

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M5M5V1132AFP-3T Mitsubishi Electric

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MITSUBISHI ELECTRIC CORP
Part Package Code QFP QFP
Package Description 14 X 14 MM, PLASTIC, TQFP-100 QFP,
Pin Count 100 100
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 3 ns
Alternate Memory Width 16
JESD-30 Code S-PQFP-G100 R-PQFP-G100
JESD-609 Code e0
Length 14 mm
Memory Density 524288 bit 1048576 bit
Memory IC Type MULTI-PORT SRAM CACHE SRAM
Memory Width 8 32
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2 1
Number of Terminals 100 100
Number of Words 65536 words 32768 words
Number of Words Code 64000 32000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX8 32KX32
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3.13 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm
Base Number Matches 1 1
Output Characteristics 3-STATE

Compare IDT70727L25PF with alternatives

Compare M5M5V1132AFP-3T with alternatives