IDT7026L35JB vs IDT7026L35JGI feature comparison

IDT7026L35JB Integrated Device Technology Inc

Buy Now Datasheet

IDT7026L35JGI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC LCC
Package Description QCCJ, QCCJ,
Pin Count 84 84
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
Additional Feature 16K X 16 DUAL PORT SRAM 16K X 16 DUAL PORT SRAM
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e3
Length 29.3116 mm 29.3116 mm
Memory Density 262144 bit 262144 bit
Memory IC Type DUAL-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 84 84
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 16KX16 16KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 4.57 mm 4.57 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.3116 mm 29.3116 mm
Base Number Matches 1 1

Compare IDT7026L35JB with alternatives

Compare IDT7026L35JGI with alternatives