IDT7025L55PF
vs
7025L55PFGB
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
Package Description
TQFP-100
QFP,
Pin Count
100
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
Additional Feature
INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP
I/O Type
COMMON
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e0
Length
14 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
100
100
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX16
8KX16
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Equivalence Code
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Standby Current-Max
0.0015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.21 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
Base Number Matches
1
1
Date Of Intro
2018-01-26
Screening Level
MIL-PRF-38535 Class Q
Compare IDT7025L55PF with alternatives
Compare 7025L55PFGB with alternatives