IDT7024L15J8 vs 70T24L15BF8 feature comparison

IDT7024L15J8 Integrated Device Technology Inc

Buy Now Datasheet

70T24L15BF8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC CABGA
Package Description PLASTIC, LCC-84 ,
Pin Count 84 100
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns
Additional Feature INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
I/O Type COMMON
JESD-30 Code S-PQCC-J84
JESD-609 Code e0 e0
Length 29.3116 mm
Memory Density 65536 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16
Moisture Sensitivity Level 1 3
Number of Functions 1
Number of Ports 2
Number of Terminals 84
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4KX16
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code QCCJ
Package Equivalence Code LDCC84,1.2SQ
Package Shape SQUARE
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified
Seated Height-Max 4.57 mm
Standby Current-Max 0.0015 A
Standby Voltage-Min 2 V
Supply Current-Max 0.26 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.3116 mm
Base Number Matches 1 1
Manufacturer Package Code BF100

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Compare 70T24L15BF8 with alternatives