IDT7008S55JI
vs
IDT7008L55JB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
LCC
Package Description
QCCJ, LDCC84,1.2SQ
QCCJ, LDCC84,1.2SQ
Pin Count
84
84
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
Additional Feature
SEMAPHORE
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQCC-J84
S-PQCC-J84
JESD-609 Code
e0
e0
Length
29.3116 mm
29.3116 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
84
84
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
64KX8
64KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC84,1.2SQ
LDCC84,1.2SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
4.57 mm
Standby Current-Max
0.03 A
0.01 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.31 mA
0.21 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn85Pb15)
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
29.3116 mm
29.3116 mm
Base Number Matches
1
1
Screening Level
MIL-PRF-38535
Compare IDT7008S55JI with alternatives
Compare IDT7008L55JB with alternatives