IDT7008S25JG
vs
IDT70908S25J8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
LCC
Package Description
QCCN, LDCC84,1.2SQ
QCCJ,
Pin Count
84
84
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
JESD-30 Code
S-PQCC-N84
S-PQCC-J84
JESD-609 Code
e3
e0
Memory Density
524288 bit
524288 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
84
84
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX8
64KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCN
QCCJ
Package Equivalence Code
LDCC84,1.2SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.015 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.305 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
NO LEAD
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Base Number Matches
1
1
Additional Feature
SELF-TIMED WRITE
Length
29.2862 mm
Output Enable
YES
Seated Height-Max
4.572 mm
Width
29.2862 mm
Compare IDT7008S25JG with alternatives
Compare IDT70908S25J8 with alternatives