IDT7007S25PF
vs
IDT7007S25
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
PGA
|
| Package Description |
14 X 14 MM, 1.40 MM HEIGHT, TQFP-80
|
1.800 X 1.800 INCH, 0.160 INCH HEIGHT, PGA-68
|
| Pin Count |
80
|
68
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
25 ns
|
| Additional Feature |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-PQFP-G80
|
S-CPGA-P68
|
| JESD-609 Code |
e0
|
e0
|
| Length |
14 mm
|
29.464 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
DUAL-PORT SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
80
|
68
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
32KX8
|
32KX8
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
LQFP
|
PGA
|
| Package Equivalence Code |
QFP80,.64SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
5.207 mm
|
| Standby Current-Max |
0.015 A
|
|
| Standby Voltage-Min |
4.5 V
|
|
| Supply Current-Max |
0.305 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
PIN/PEG
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
14 mm
|
29.464 mm
|
| Base Number Matches |
13
|
38
|
|
|
|
Compare IDT7007S25PF with alternatives
Compare IDT7007S25 with alternatives