IDT7007S25GGB
vs
7007L25JB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PGA
LCC
Package Description
PGA, PGA68,11X11
QCCJ, LDCC68,1.0SQ
Pin Count
68
68
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-CPGA-P68
S-PQCC-J68
JESD-609 Code
e3
e0
Length
29.464 mm
24.2062 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
68
68
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
PGA
QCCJ
Package Equivalence Code
PGA68,11X11
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
MIL-PRF-38535
Seated Height-Max
3.683 mm
4.572 mm
Standby Current-Max
0.03 A
0.01 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.345 mA
0.305 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
PIN/PEG
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
PERPENDICULAR
QUAD
Width
29.464 mm
24.2062 mm
Base Number Matches
2
4
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
20
Compare IDT7007S25GGB with alternatives
Compare 7007L25JB with alternatives