IDT7006S17JG vs IDT7006L17GG feature comparison

IDT7006S17JG Integrated Device Technology Inc

Buy Now Datasheet

IDT7006L17GG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC PGA
Package Description QCCJ, LDCC68,1.0SQ PGA, PGA68,11X11
Pin Count 68 68
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 17 ns 17 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQCC-J68 S-CPGA-P68
JESD-609 Code e3 e3
Length 24.2062 mm 27.889 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 68 68
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 16KX8 16KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ PGA
Package Equivalence Code LDCC68,1.0SQ PGA68,11X11
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 2.413 mm
Standby Current-Max 0.015 A 0.0015 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.31 mA 0.26 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed MATTE TIN
Terminal Form J BEND PIN/PEG
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Time@Peak Reflow Temperature-Max (s) 30
Width 24.2062 mm 27.889 mm
Base Number Matches 1 1

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