IDT7005S55PFB
vs
IDT7005L55JI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
LCC
Package Description
LQFP, QFP64,.66SQ,32
0.950 X 0.950 INCH, 0.120 INCH HEIGHT, PLASTIC, LCC-68
Pin Count
64
68
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQFP-G64
S-PQCC-J68
JESD-609 Code
e0
e0
Length
14 mm
24.2062 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
64
68
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QCCJ
Package Equivalence Code
QFP64,.66SQ,32
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
4.572 mm
Standby Current-Max
0.03 A
0.004 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.3 mA
0.25 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
20
Width
14 mm
24.2062 mm
Base Number Matches
1
2
Additional Feature
SEMAPHORE; AUTOMATIC POWER DOWN
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