IDT6167LA25SO8 vs NMC2147HJ-2 feature comparison

IDT6167LA25SO8 Integrated Device Technology Inc

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NMC2147HJ-2 Texas Instruments

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP18,.3
Pin Count 20 18
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 45 ns
JESD-30 Code R-PDSO-G20 R-GDIP-T18
JESD-609 Code e0 e0
Length 12.8 mm
Memory Density 16384 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 20 18
Number of Words 16384 words 4096 words
Number of Words Code 16000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 16KX1 4KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 5.08 mm
Standby Voltage-Min 2 V 4.5 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS NMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.62 mm
Base Number Matches 1 2
I/O Type SEPARATE
Package Equivalence Code DIP18,.3
Supply Current-Max 0.18 mA

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Compare NMC2147HJ-2 with alternatives