IDT61298L25C vs MT5C2565C-25IT feature comparison

IDT61298L25C Integrated Device Technology Inc

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MT5C2565C-25IT Micron Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code DIP
Package Description 0.300 INCH, SIDE BRAZED, DIP-28
Pin Count 28
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON COMMON
JESD-30 Code R-CDIP-T28 R-XDIP-T28
JESD-609 Code e0 e0
Length 35.56 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64KX4 64KX4
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP28,.3 DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.0005 A 0.008 A
Standby Voltage-Min 2 V 4.5 V
Supply Current-Max 0.14 mA 0.11 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1

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