IDT6116LA150DB vs AM9128-15DC feature comparison

IDT6116LA150DB Integrated Device Technology Inc

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AM9128-15DC Msis Semiconductor Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MSIS SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP24,.6 DIP, DIP24,.6
Pin Count 24
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 1988-01-01
Access Time-Max 150 ns 150 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T24 R-XDIP-T24
JESD-609 Code e0 e0
Length 32.004 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1
Number of Ports 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 2KX8 2KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 4.826 mm
Standby Current-Max 0.0002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.085 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 3

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