IDT6116LA150DB
vs
AM9128-15DC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MSIS SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP, DIP24,.6
DIP, DIP24,.6
Pin Count
24
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Date Of Intro
1988-01-01
Access Time-Max
150 ns
150 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T24
R-XDIP-T24
JESD-609 Code
e0
e0
Length
32.004 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
Number of Ports
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
2KX8
2KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
4.826 mm
Standby Current-Max
0.0002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.085 mA
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
MOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
3
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