IDT6116LA120EB vs MAS6216FL feature comparison

IDT6116LA120EB Integrated Device Technology Inc

Buy Now Datasheet

MAS6216FL Microsemi Corporation

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MICROSEMI CORP
Part Package Code DFP
Package Description 0.300 INCH, CERPACK-24 ,
Pin Count 24
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 120 ns
I/O Type COMMON
JESD-30 Code R-GDFP-F24
JESD-609 Code e0
Length 15.748 mm
Memory Density 16384 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, GLASS-SEALED
Package Code DFP
Package Equivalence Code FL24,.4
Package Shape RECTANGULAR
Package Style FLATPACK
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 2.286 mm
Standby Current-Max 0.0002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.085 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form FLAT
Terminal Pitch 1.27 mm
Terminal Position DUAL
Width 9.144 mm
Base Number Matches 1 3

Compare IDT6116LA120EB with alternatives