IDT5V9955BFI
vs
IDT5V9955BFI8
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA, BGA96,6X16,32
|
LFBGA, BGA96,6X16,32
|
Pin Count |
96
|
96
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
5V
|
5V
|
Input Conditioning |
STANDARD
|
STANDARD
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B96
|
JESD-609 Code |
e0
|
e0
|
Length |
13.5 mm
|
13.5 mm
|
Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Max I(ol) |
0.012 A
|
0.012 A
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
2
|
2
|
Number of Inverted Outputs |
|
|
Number of Terminals |
96
|
96
|
Number of True Outputs |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA96,6X16,32
|
BGA96,6X16,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.5 ns
|
0.5 ns
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Lead (Sn63Pb37)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
5.5 mm
|
5.5 mm
|
fmax-Min |
200 MHz
|
200 MHz
|
Base Number Matches |
2
|
1
|
|
|
|
Compare IDT5V9955BFI with alternatives
Compare IDT5V9955BFI8 with alternatives