IDT49C465APQFB
vs
AM29C660GC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
QFP
|
PGA
|
| Package Description |
QFP,
|
PGA, PGA68,11X11
|
| Pin Count |
144
|
68
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
FLOW-THROUGH EDAC; 64 BIT GENERATE MODE; BUILT IN DIAGNOSTICS; ON CHIP PIPELINING; BYTE CONTROL
|
BUILT IN DIAGNOSTICS; BYTE CONTROL
|
| Family |
49C
|
CMOS
|
| JESD-30 Code |
S-PQFP-G144
|
S-CPGA-P68
|
| JESD-609 Code |
e0
|
e0
|
| Length |
28 mm
|
29.464 mm
|
| Logic IC Type |
ERROR DETECTION AND CORRECTION CIRCUIT
|
ERROR DETECTION AND CORRECTION CIRCUIT
|
| Number of Bits |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
144
|
68
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFP
|
PGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.07 mm
|
4.953 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
PIN/PEG
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Width |
28 mm
|
29.464 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Load Capacitance (CL) |
|
50 pF
|
| Package Equivalence Code |
|
PGA68,11X11
|
| Propagation Delay (tpd) |
|
49 ns
|
|
|
|
Compare IDT49C465APQFB with alternatives
Compare AM29C660GC with alternatives