IDT49C460BJ
vs
IDT49C465PQF8
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
LCC
|
QFP
|
Package Description |
0.050 INCH PITCH, PLASTIC, LCC-68
|
QFP,
|
Pin Count |
68
|
144
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
BUILT IN DIAGNOSTICS
|
FLOW-THROUGH EDAC; 64 BIT GENERATE MODE; BUILT IN DIAGNOSTICS; ON CHIP PIPELINING; BYTE CONTROL
|
Family |
49C
|
49C
|
JESD-30 Code |
S-PQCC-J68
|
S-PQFP-G144
|
JESD-609 Code |
e0
|
e0
|
Length |
24.2062 mm
|
28 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
ERROR DETECTION AND CORRECTION CIRCUIT
|
ERROR DETECTION AND CORRECTION CIRCUIT
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
144
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QFP
|
Package Equivalence Code |
LDCC68,1.0SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
225
|
|
Propagation Delay (tpd) |
30 ns
|
16 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.07 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
24.2062 mm
|
28 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IDT49C460BJ with alternatives
Compare IDT49C465PQF8 with alternatives