IDT39C60-1CB vs HD74LS148FPEL feature comparison

IDT39C60-1CB Integrated Device Technology Inc

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HD74LS148FPEL Renesas Electronics Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code DIP SOIC
Package Description DIP, DIP48,.6 SOP, SOP16,.3
Pin Count 48 16
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature BUILT IN DIAGNOSTICS; BYTE CONTROL
Family CMOS LS
JESD-30 Code R-CDIP-T48 R-PDSO-G16
JESD-609 Code e0
Length 60.96 mm 10.06 mm
Load Capacitance (CL) 50 pF
Logic IC Type ERROR DETECTION AND CORRECTION CIRCUIT ENCODER
Number of Bits 16 8
Number of Functions 1 1
Number of Terminals 48 16
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C -20 °C
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP48,.6 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 59 ns 36 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 4.826 mm 2.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 5.5 mm
Base Number Matches 1 1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

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Compare HD74LS148FPEL with alternatives