IDT29FCT520DTEB
vs
CY29FCT520CTDC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DFP
DIP
Package Description
DFP,
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Boundary Scan
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-GDFP-F24
R-GDIP-T24
JESD-609 Code
e0
Low Power Mode
NO
YES
Number of Terminals
24
24
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Data Bus Width
8
8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DFP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
2.286 mm
5.08 mm
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
9.144 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, PIPELINE REGISTER
DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches
1
1
Additional Feature
MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
Length
31.877 mm
Supply Current-Max
21.8 mA
Compare IDT29FCT520DTEB with alternatives
Compare CY29FCT520CTDC with alternatives