IDT29FCT520CD vs 5962-8873603LA feature comparison

IDT29FCT520CD Integrated Device Technology Inc

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5962-8873603LA Pyramid Semiconductor Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC PERFORMANCE SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP24,.3 DIP,
Pin Count 24 24
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
Boundary Scan NO NO
External Data Bus Width 8 8
JESD-30 Code R-GDIP-T24
JESD-609 Code e0 e0
Length 32.004 mm 32.004 mm
Low Power Mode NO NO
Number of Terminals 24
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Data Bus Width 8 8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 21.8 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, PIPELINE REGISTER DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches 1 2
ECCN Code 3A001.A.2.C

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Compare 5962-8873603LA with alternatives