IDT29FCT520ATSO8
vs
IDT29FCT520BSO
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
SOP, SOP24,.4
|
DFP, SOP24,.4
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
MULTIPLEXED OUTPUT
|
MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-PDSO-G24
|
R-GDFP-F24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
15.4178 mm
|
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Data Bus Width |
8
|
8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP24,.4
|
SOP24,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.6416 mm
|
2.286 mm
|
| Supply Current-Max |
16.3 mA
|
21.8 mA
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
7.5184 mm
|
9.144 mm
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, PIPELINE REGISTER
|
DSP PERIPHERAL, PIPELINE REGISTER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare IDT29FCT520ATSO8 with alternatives
Compare IDT29FCT520BSO with alternatives