IDT2308-2HPGI8
vs
IDT5992A-2J8
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
TSSOP
|
|
Package Description |
TSSOP-16
|
QCCJ,
|
Pin Count |
16
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
2308
|
|
Input Conditioning |
STANDARD
|
STANDARD
|
JESD-30 Code |
R-PDSO-G16
|
R-PQCC-J32
|
JESD-609 Code |
e0
|
e0
|
Length |
5 mm
|
13.97 mm
|
Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Max I(ol) |
0.012 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
16
|
32
|
Number of True Outputs |
8
|
8
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
QCCJ
|
Package Equivalence Code |
TSSOP16,.25
|
LDCC32,.5X.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.2 ns
|
0.25 ns
|
Seated Height-Max |
1.2 mm
|
3.55 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
4.4 mm
|
11.43 mm
|
fmax-Min |
133.3 MHz
|
100 MHz
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IDT2308-2HPGI8 with alternatives
Compare IDT5992A-2J8 with alternatives