IDM29751NC
vs
S82S23F
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP16,.3
,
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
30 ns
JESD-30 Code
R-PDIP-T16
JESD-609 Code
e0
Memory Density
256 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
16
Number of Words
32 words
Number of Words Code
32
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32X8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.937 mm
Supply Current-Max
0.11 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
BIPOLAR
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Base Number Matches
2
3
Compare IDM29751NC with alternatives
Compare S82S23F with alternatives