ICX039DNB
vs
ICX039BNB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SONY CORP
|
SONY CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
WSDIP,
|
DIP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
R-CDIP-T16
|
R-CDIP-T16
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
60 °C
|
|
| Operating Temperature-Min |
-10 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
WSDIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE, WINDOW, SHRINK PITCH
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.59 mm
|
4.59 mm
|
| Supply Voltage-Max (Vsup) |
15.45 V
|
|
| Supply Voltage-Min (Vsup) |
14.55 V
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Length |
|
12.35 mm
|
|
|
|