ICSSTUF32864EH
vs
SSTU32864EC
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
LFBGA,
|
FBGA, BGA96,6X16,32
|
Pin Count |
96
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
SSTU
|
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B96
|
JESD-609 Code |
e0
|
e0
|
Length |
13.5 mm
|
|
Logic IC Type |
D FLIP-FLOP
|
BUS DRIVER
|
Number of Bits |
25
|
|
Number of Functions |
1
|
|
Number of Terminals |
96
|
96
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
FBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Propagation Delay (tpd) |
2 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
|
Supply Voltage-Max (Vsup) |
1.9 V
|
|
Supply Voltage-Min (Vsup) |
1.7 V
|
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Trigger Type |
POSITIVE EDGE
|
|
Width |
5.5 mm
|
|
fmax-Min |
270 MHz
|
|
Base Number Matches |
1
|
3
|
Package Equivalence Code |
|
BGA96,6X16,32
|
Technology |
|
CMOS
|
|
|
|
Compare ICSSTUF32864EH with alternatives