ICSSSTVA32852YH-T
vs
PI74SSTVF32852NBE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
PERICOM SEMICONDUCTOR CORP
Package Description
LFBGA,
LFBGA, BGA114,6X19,32
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTV
SSTV
JESD-30 Code
R-PBGA-B114
R-PBGA-B114
JESD-609 Code
e0
e1
Length
16 mm
16 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
24
24
Number of Functions
1
1
Number of Terminals
114
114
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA114,6X19,32
BGA114,6X19,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
1.8 ns
2.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.45 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
5.5 mm
fmax-Min
220 MHz
210 MHz
Base Number Matches
1
2
Part Package Code
BGA
Pin Count
114
ECCN Code
EAR99
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Technology
CMOS
Time@Peak Reflow Temperature-Max (s)
40
Compare ICSSSTVA32852YH-T with alternatives
Compare PI74SSTVF32852NBE with alternatives