ICSSSTVA16859CGLF-T
vs
SSTV16859MTDX
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
0.240 INCH, LEAD FREE, MO-153, TSSOP-64
|
TSSOP,
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
SSTV
|
SSTV
|
| JESD-30 Code |
R-PDSO-G64
|
R-PDSO-G64
|
| JESD-609 Code |
e3
|
e3
|
| Length |
17 mm
|
17 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Bits |
13
|
13
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP64,.32,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
2.6 ns
|
2.8 ns
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
6.1 mm
|
6.1 mm
|
| fmax-Min |
210 MHz
|
200 MHz
|
| Base Number Matches |
2
|
2
|
| Technology |
|
CMOS
|
|
|
|
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