ICSSSTUF32866EHT vs ICSSSTUF32864AYHLF-T feature comparison

ICSSSTUF32866EHT Integrated Device Technology Inc

Buy Now Datasheet

ICSSSTUF32864AYHLF-T Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LFBGA, BGA96,6X16,32 LFBGA,
Pin Count 96 96
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
Family SSTU SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0 e3
Length 13.5 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3
Number of Bits 25 25
Number of Functions 1 1
Number of Terminals 96 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 225
Propagation Delay (tpd) 2.35 ns 1.75 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) MATTE TIN
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.5 mm
fmax-Min 270 MHz 270 MHz
Base Number Matches 1 1

Compare ICSSSTUF32866EHT with alternatives

Compare ICSSSTUF32864AYHLF-T with alternatives