ICSSSTUF32866EHLFT vs ICSSSTU32864YHLFT feature comparison

ICSSSTUF32866EHLFT Integrated Device Technology Inc

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ICSSSTU32864YHLFT Renesas Electronics Corporation

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code BGA
Package Description LFBGA, BGA96,6X16,32 LFBGA,
Pin Count 96
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
Family SSTU SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e1 e1
Length 13.5 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3
Number of Bits 25 25
Number of Functions 1 1
Number of Terminals 96 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 2.35 ns 1.85 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.5 mm
fmax-Min 270 MHz 270 MHz
Base Number Matches 1 2

Compare ICSSSTUF32866EHLFT with alternatives

Compare ICSSSTU32864YHLFT with alternatives