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ICSSSTUAF32868AHLFT vs SSTUP32866EC/G,518 feature comparison

ICSSSTUAF32868AHLFT Integrated Device Technology Inc

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SSTUP32866EC/G,518 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description LFBGA, BGA176,8X22,25 LFBGA,
Pin Count 176 96
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 32868 32866
JESD-30 Code R-PBGA-B176 R-PBGA-B96
JESD-609 Code e1
Length 15 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3 2
Number of Bits 28 25
Number of Functions 1 1
Number of Terminals 176 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA176,8X22,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 3 ns 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 6 mm 5.5 mm
fmax-Min 410 MHz 450 MHz
Base Number Matches 1 1
Manufacturer Package Code SOT536-1
Output Characteristics OPEN-DRAIN
Technology CMOS
Logic » FF/Latches
Logic » FF/Latches

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Compare SSTUP32866EC/G,518 with alternatives