ICSSSTUA32866BHMLFT vs SSTUA32866EC/G feature comparison

ICSSSTUA32866BHMLFT Integrated Device Technology Inc

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SSTUA32866EC/G NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description TFBGA, LFBGA, BGA96,6X16,32
Pin Count 96 96
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU 32866
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e3
Length 11.5 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 25 14
Number of Functions 1 1
Number of Terminals 96 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA96,6X16,25 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 1.9 ns 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5 mm 5.5 mm
fmax-Min 410 MHz 450 MHz
Base Number Matches 1 2
Manufacturer Package Code SOT-536-1
Moisture Sensitivity Level 2
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) NOT SPECIFIED
Technology CMOS
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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