ICSSSTUA32866BHMLFT
vs
SSTUA32866EC/G
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA,
|
LFBGA, BGA96,6X16,32
|
Pin Count |
96
|
96
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
SSTU
|
32866
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B96
|
JESD-609 Code |
e3
|
|
Length |
11.5 mm
|
13.5 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Number of Bits |
25
|
14
|
Number of Functions |
1
|
1
|
Number of Terminals |
96
|
96
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
TRUE
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
LFBGA
|
Package Equivalence Code |
BGA96,6X16,25
|
BGA96,6X16,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Propagation Delay (tpd) |
1.9 ns
|
1.8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.5 mm
|
Supply Voltage-Max (Vsup) |
1.9 V
|
2 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
5 mm
|
5.5 mm
|
fmax-Min |
410 MHz
|
450 MHz
|
Base Number Matches |
1
|
2
|
Manufacturer Package Code |
|
SOT-536-1
|
Moisture Sensitivity Level |
|
2
|
Output Characteristics |
|
OPEN-DRAIN
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare ICSSSTUA32866BHMLFT with alternatives
Compare SSTUA32866EC/G with alternatives