ICSSSTUA32864BHLF-T
vs
IDT74SSTUBF32868ABKG8
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
LFBGA,
|
FBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
SSTU
|
SSTU
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B176
|
JESD-609 Code |
e1
|
e1
|
Length |
13.5 mm
|
15 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Moisture Sensitivity Level |
3
|
3
|
Number of Bits |
25
|
28
|
Number of Functions |
1
|
1
|
Number of Terminals |
96
|
176
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
FBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
1.9 ns
|
1.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
5.5 mm
|
6 mm
|
fmax-Min |
410 MHz
|
410 MHz
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
176
|
Package Equivalence Code |
|
BGA176,8X22,25
|
Technology |
|
TTL
|
|
|
|
Compare ICSSSTUA32864BHLF-T with alternatives
Compare IDT74SSTUBF32868ABKG8 with alternatives