ICS98ULPA877AHILF-T vs ICS97ULP877BHLF-T feature comparison

ICS98ULPA877AHILF-T Integrated Device Technology Inc

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ICS97ULP877BHLF-T Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description ROHS COMPLIANT, PLASTIC, MO-205, M0-225, VFBGA-52 LEAD FREE ANNEALED, MO-205, MO-225, BGA-52
Pin Count 52 52
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 98ULPA 97ULP
Input Conditioning DIFFERENTIAL DIFFERENTIAL
JESD-30 Code R-PBGA-B52 R-PBGA-B52
JESD-609 Code e1 e1
Length 7 mm 7 mm
Logic IC Type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Max I(ol) 0.009 A
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 52 52
Number of True Outputs 10 10
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA VFBGA
Package Equivalence Code BGA52,6X10,25 BGA52,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.04 ns 0.04 ns
Seated Height-Max 1.31 mm 1 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.5 mm 5.5 mm
fmax-Min 410 MHz 410 MHz
Base Number Matches 2 2

Compare ICS98ULPA877AHILF-T with alternatives

Compare ICS97ULP877BHLF-T with alternatives