ICS98ULPA877AHILF-T
vs
ICS97ULP877BHLF-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
LFBGA, BGA52,6X10,25
LEAD FREE ANNEALED, MO-205, MO-225, BGA-52
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
98ULPA
97ULP
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL
JESD-30 Code
R-PBGA-B52
R-PBGA-B52
JESD-609 Code
e1
e1
Length
7 mm
7 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.009 A
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
52
52
Number of True Outputs
10
10
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
VFBGA
Package Equivalence Code
BGA52,6X10,25
BGA52,6X10,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.04 ns
0.04 ns
Seated Height-Max
1.31 mm
1 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.5 mm
5.5 mm
fmax-Min
410 MHz
410 MHz
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
52
Compare ICS98ULPA877AHILF-T with alternatives
Compare ICS97ULP877BHLF-T with alternatives