ICS97ULP877BHLF-T
vs
98ULPA877AHI-T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LEAD FREE ANNEALED, MO-205, MO-225, BGA-52
LFBGA, BGA52,6X10,25
Pin Count
52
52
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
97ULP
98ULPA
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL
JESD-30 Code
R-PBGA-B52
R-PBGA-B52
JESD-609 Code
e1
e0
Length
7 mm
7 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
52
52
Number of True Outputs
10
10
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
LFBGA
Package Equivalence Code
BGA52,6X10,25
BGA52,6X10,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.04 ns
0.04 ns
Seated Height-Max
1 mm
1.31 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
5.5 mm
4.5 mm
fmax-Min
410 MHz
410 MHz
Base Number Matches
2
1
Max I(ol)
0.009 A
Compare ICS97ULP877BHLF-T with alternatives
Compare 98ULPA877AHI-T with alternatives