ICS97ULP877BH vs ICS97ULP877BHLF-T feature comparison

ICS97ULP877BH Integrated Device Technology Inc

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ICS97ULP877BHLF-T Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description PLASTIC, MO-205, MO-225, FBGA-52 LEAD FREE ANNEALED, MO-205, MO-225, BGA-52
Pin Count 52 52
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 97ULP 97ULP
Input Conditioning DIFFERENTIAL DIFFERENTIAL
JESD-30 Code R-PBGA-B52 R-PBGA-B52
JESD-609 Code e0 e1
Length 7 mm 7 mm
Logic IC Type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 52 52
Number of True Outputs 10 10
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.04 ns 0.04 ns
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 4.5 mm 5.5 mm
fmax-Min 350 MHz 410 MHz
Base Number Matches 4 1
Pbfree Code Yes
Moisture Sensitivity Level 3
Package Equivalence Code BGA52,6X10,25
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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