ICS97U877AKI
vs
ICS98ULPA877AKI-T
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
DFN
|
DFN
|
| Package Description |
VQCCN,
|
PLASTIC, MLF-40
|
| Pin Count |
40
|
40
|
| Manufacturer Package Code |
MLF
|
MLF
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
97U
|
98ULPA
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
S-PQCC-N40
|
S-PQCC-N40
|
| JESD-609 Code |
e3
|
e0
|
| Length |
6 mm
|
6 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
40
|
40
|
| Number of True Outputs |
10
|
10
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.04 ns
|
0.04 ns
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
6 mm
|
6 mm
|
| fmax-Min |
350 MHz
|
410 MHz
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
|
|
|
Compare ICS97U877AKI with alternatives
Compare ICS98ULPA877AKI-T with alternatives