ICS97U877AHLF
vs
ICS97U877AHLFT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
VFBGA, BGA52,6X10,25
VFBGA, BGA52,6X10,25
Pin Count
52
52
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
97U
97U
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL
JESD-30 Code
R-PBGA-B52
R-PBGA-B52
JESD-609 Code
e1
e1
Length
7 mm
7 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.009 A
0.009 A
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
52
52
Number of True Outputs
10
10
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA52,6X10,25
BGA52,6X10,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.04 ns
0.04 ns
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.5 mm
4.5 mm
fmax-Min
350 MHz
350 MHz
Base Number Matches
3
2
Compare ICS97U877AHLF with alternatives
Compare ICS97U877AHLFT with alternatives