ICS873033AGLF
vs
ICS873032AM
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
TSSOP
|
SOIC
|
Package Description |
3 X 3 MM, 0.95 MM HEIGHT, ROHS COMPLIANT, MO-187, TSSOP-8
|
SOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
Family |
873033
|
873032
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e0
|
Length |
3 mm
|
4.9 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
8
|
8
|
Number of True Outputs |
1
|
1
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-COLLECTOR
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Propagation Delay (tpd) |
0.53 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
3 mm
|
3.9 mm
|
Base Number Matches |
2
|
4
|
|
|
|
Compare ICS873033AGLF with alternatives
Compare ICS873032AM with alternatives