ICS8543BGLF
vs
8SLVP1102ANLGI/W
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
RENESAS ELECTRONICS CORP
Part Package Code
TSSOP
VFQFPN
Package Description
TSSOP, TSSOP20,.25
HQCCN, LCC16,.12SQ,20
Pin Count
20
16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Input Conditioning
DIFFERENTIAL MUX
DIFFERENTIAL
JESD-30 Code
R-PDSO-G20
S-PQCC-N16
JESD-609 Code
e3
e3
Length
6.5 mm
3 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
20
16
Number of True Outputs
4
2
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HVQCCN
Package Equivalence Code
TSSOP20,.25
LCC16,.12SQ,20
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
2.6 ns
Propagation Delay (tpd)
2.6 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.04 ns
0.015 ns
Seated Height-Max
1.2 mm
1 mm
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
3 mm
Base Number Matches
1
2
Manufacturer Package Code
NLG16P2
Factory Lead Time
12 Weeks
Samacsys Manufacturer
Renesas Electronics
Additional Feature
ALSO OPERATES AT 3.3 V SUPPLY
Family
8SLVP
Packing Method
TR
Power Supply Current-Max (ICC)
106 mA
Compare ICS8543BGLF with alternatives
Compare 8SLVP1102ANLGI/W with alternatives