ICS85357AG-01 vs SY100EP57VK4ITR feature comparison

ICS85357AG-01 Integrated Device Technology Inc

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SY100EP57VK4ITR Microchip Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MICREL INC
Part Package Code TSSOP TSSOP
Package Description 4.40 X 6.50 MM, 0.90 MM HEIGHT, MO-153, TSSOP-20 TSSOP, TSSOP20,.25
Pin Count 20 20
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ECL MODE: VCC = 0V WITH VEE = -3.135V TO -3.465V ECL MODE: VCC = 0V WITH VEE = -3 TO -5.5V
Family 85357 100E
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e0
Length 6.5 mm 6.5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 1
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 20 20
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP20,.25 TSSOP20,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup 1.5 ns 0.52 ns
Propagation Delay (tpd) 1.5 ns 0.475 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.465 V 5.5 V
Supply Voltage-Min (Vsup) 3.135 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 2
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 240
Power Supply Current-Max (ICC) 50 mA
Technology ECL
Time@Peak Reflow Temperature-Max (s) 30

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