ICM7556MJD
vs
LM556J-MIL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
height maximum considered
Analog IC - Other Type
TIMER
PULSE; RECTANGULAR
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Length
19.839 mm
19.43 mm
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Frequency-Max
0.5 MHz
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
240
260
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max (Isup)
0.6 mA
Supply Voltage-Max (Vsup)
16 V
16 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn63Pb37)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
40
Width
7.62 mm
7.62 mm
Base Number Matches
7
1
Samacsys Manufacturer
Texas Instruments
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Compare ICM7556MJD with alternatives
Compare LM556J-MIL with alternatives