ICM7556MJD vs LM556J feature comparison

ICM7556MJD Renesas Electronics Corporation

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LM556J Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NATIONAL SEMICONDUCTOR CORP
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Renesas Electronics Texas Instruments
Additional Feature LG-MAX
Analog IC - Other Type SQUARE RECTANGULAR
JESD-30 Code R-CDIP-T14 R-GDIP-T14
Length 19.94 mm 19.43 mm
Number of Functions 1 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Frequency-Max 1 MHz
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max (Isup) 0.6 mA
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS BIPOLAR
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 7 2
JESD-609 Code e0
Package Equivalence Code DIP14,.3
Qualification Status Not Qualified
Temperature Grade MILITARY
Terminal Finish TIN LEAD

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