ICM7556MJD/883B
vs
SE556-1F/883B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
GENERAL ELECTRIC SOLID STATE
|
SIGNETICS CORP
|
Package Description |
DIP-14
|
DIP, DIP14,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
PULSE; RECTANGULAR
|
PULSE
|
JESD-30 Code |
R-CDIP-T14
|
R-CDIP-T14
|
JESD-609 Code |
e0
|
e0
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Frequency-Max |
1 MHz
|
0.5 MHz
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
MIL-STD-883 Class B
|
Supply Current-Max (Isup) |
0.6 mA
|
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
BIPOLAR
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
3
|
Additional Feature |
|
IT CAN ALSO OPERATE AT 15V NOM
|
Package Equivalence Code |
|
DIP14,.3
|
Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare SE556-1F/883B with alternatives