ICM7556IPD+
vs
SA556-1F
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
SIGNETICS CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-14
|
DIP, DIP14,.3
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SQUARE
|
|
| JESD-30 Code |
R-PDIP-T14
|
R-CDIP-T14
|
| JESD-609 Code |
e3
|
e0
|
| Length |
19.05 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Output Frequency-Max |
0.5 MHz
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
|
| Supply Current-Max (Isup) |
0.6 mA
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare ICM7556IPD+ with alternatives
Compare SA556-1F with alternatives